The use of lead-free solder can lead to increased oxide formation on the surface of the solder tip.
These oxides must be carefully removed, as they soon form a black, unwettable separating coating.
The conventional cleaning method with a damp sponge can cause a sudden drop in temperature, reducing the service life of the solder tip.
Cleaning of the solder tip in the WDC Dry Cleaner involves use of a special wool spiral.
In the preliminary cleaning stage the contaminated used solder is knocked against a soft edge into the collector.
Then in the advanced cleaning stage the solder tip is wiped or turned in the wool spiral.
Following the advanced cleaning stage a thin residual solder layer remains, which prevents immediate oxidation of the solder tip.
This is a considerable advantage over sponge cleaning.