Price search results for PC CPU VGA Thermal Compound Cooling paste 8g Syringe ≥4.63Wm k Silver
Cooling paste | ≥4.63W/m-k | SilverThis Nedis cooling paste is very heat conductive. It fills in all those microscopic imperfections...read more
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Cooling paste | ≥4.
63W/m-k | SilverThis Nedis cooling paste is very heat conductive.
It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance.
The cooling paste ensures an outstanding heat conduction and dissipation.
This allows you to run heavy programs without the motherboard getting overheated.
DetailsThis Nedis® cooling paste is very heat conductive.
It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance.
The cooling paste ensures an outstanding heat conduction and dissipation.
This allows you to run heavy programs without the motherboard getting overheated.
• High stability and reliability• Suitable to be applied to CPU, UPS, inverter, chipset and other PC components• Low thermal resistance, high conductivity for heat transfer
63W/m-k | SilverThis Nedis cooling paste is very heat conductive.
It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance.
The cooling paste ensures an outstanding heat conduction and dissipation.
This allows you to run heavy programs without the motherboard getting overheated.
DetailsThis Nedis® cooling paste is very heat conductive.
It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance.
The cooling paste ensures an outstanding heat conduction and dissipation.
This allows you to run heavy programs without the motherboard getting overheated.
• High stability and reliability• Suitable to be applied to CPU, UPS, inverter, chipset and other PC components• Low thermal resistance, high conductivity for heat transfer