With continuous flux core, with more active fluxEutectic alloy prevents the so-called "sticking" of components Responsive fluxing agent for good flow behavior Sn96.
5 Ag3 Cu0.
5 with F-SW 26 Also suitable for dirty components Open copper pads can also be soldered without any hesitation Short wetting time Easier to work because of the low formation of solder balls 3 metals simplify lead-free workingMelting point: Solidus 217°C Liquidus: 217°C.
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